Brand Name : Bergquist
Model Number : 5000S35
Certification : ROHS/UL/COC/COA/SGS
Place of Origin : US
MOQ : 1 m2
Price : Based on Dimension and Qty
Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram, PayPal
Supply Ability : 10000 m2/Month
Delivery Time : 5-8 Working Days
Packaging Details : Poly Bag + Strong Cartons
Item : Gap Pad 5000S35
Material : Fiberglass-Reinforced Filler and Polymer
Color : Light Green
Thickness : 0.508 to 3.175 mm
Dielectric Breakdown Voltage (Vac) : >5000
Thermal Conductivity (W/m-K) : 5.0
Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability. The fiberglass reinforcement provides easy handling and converting, added electrical isolation and tear resistance. The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. The top side has reduced tack for ease of handling. Gap Pad 5000S35 is ideal for high-performance applications at low mounting pressures.
• High thermal conductivity: 5 W/m-K
• Highly conformable,“S-Class” softness
• Natural inherent tack reduces interfacial thermal resistance
• Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads
• Fiberglass reinforced for puncture, shear and tear resistance
• Excellent thermal performance at low pressures
• CDROM / DVD ROM
• Voltage Regulator Modules ( VRMs) and POLs
• Thermally-enhanced BGAs
• Memory packages / modules
• PC Board to chassis
• ASICs and DSPs
Die-cut parts are available in any shape or size, separated or in sheet form
High Thermal Conductivity Plus S-Class Softness And Conformability Gap Pad Images |