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High Thermal Conductivity Plus S-Class Softness And Conformability Gap Pad

Kingzom Co., Limited

High Thermal Conductivity Plus S-Class Softness And Conformability Gap Pad

Brand Name : Bergquist

Model Number : 5000S35

Certification : ROHS/UL/COC/COA/SGS

Place of Origin : US

MOQ : 1 m2

Price : Based on Dimension and Qty

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram, PayPal

Supply Ability : 10000 m2/Month

Delivery Time : 5-8 Working Days

Packaging Details : Poly Bag + Strong Cartons

Item : Gap Pad 5000S35

Material : Fiberglass-Reinforced Filler and Polymer

Color : Light Green

Thickness : 0.508 to 3.175 mm

Dielectric Breakdown Voltage (Vac) : >5000

Thermal Conductivity (W/m-K) : 5.0

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High Thermal Conductivity Plus “S-Class” Softness And Conformability Gap Pad

Product Description

Gap Pad 5000S35 is a fiberglass-reinforced filler and polymer featuring a high thermal conductivity. The material yields extremely soft characteristics while maintaining elasticity and conformability. The fiberglass reinforcement provides easy handling and converting, added electrical isolation and tear resistance. The inherent natural tack on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. The top side has reduced tack for ease of handling. Gap Pad 5000S35 is ideal for high-performance applications at low mounting pressures.

Features and Benefits

• High thermal conductivity: 5 W/m-K
• Highly conformable,“S-Class” softness
• Natural inherent tack reduces interfacial thermal resistance

• Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads
• Fiberglass reinforced for puncture, shear and tear resistance

• Excellent thermal performance at low pressures

TYPICAL PROPERTIES

High Thermal Conductivity Plus S-Class Softness And Conformability Gap Pad

Typical Applications

• CDROM / DVD ROM
• Voltage Regulator Modules ( VRMs) and POLs
• Thermally-enhanced BGAs
• Memory packages / modules
• PC Board to chassis
• ASICs and DSPs

Configurations Available

Die-cut parts are available in any shape or size, separated or in sheet form


Product Tags:

heat conductive tape

      

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